Hisense enters into a strategic manufacturing alliance with EPACK Durable Limited (EDL)
Hisense has entered into a strategic manufacturing alliance with EPACK Durable Limited (EDL), one of India’s contract manufacturers.
Hisense has contracted EPACK Durable to setup advanced dedicated manufacturing facility in India to produce Hisense range of Air conditioners and Home Appliances using Hisense’s proprietary technology & designs.
This local manufacturing of its products by Hisense, is not only a step towards its commitment to enhancing manufacturing capabilities through Make in India, but also a reflection of its vision to introduce Hisense’s latest technologically superior, smart and premium-quality home appliances to India market, and there by help establish Hisense as a top 5 Brands in Air-conditioner and home appliances in India within next 5 years, in line with its global standing.
Steven Li, Managing Director of Hisense India, said, “We are very thrilled to join forces with EPACK, a company that shares our dedication to excellence and innovation. This partnership will not only enhance our manufacturing capabilities but also allow us to focus on what we do best: creating outstanding products that resonate with Indian consumers.”
Mr. Ajay DD Singhania, Managing Director & CEO of EPACK Durable Limited, said, “This collaboration with Hisense opens new opportunities for growth in both domestic and international markets. With our combined strengths, we are poised to redefine excellence in the home appliance industry.”
Investment in Technology, design and production capacity
Through this agreement, EPACK Durable Limited will invest in advanced and dedicated production lines for manufacturing Air conditioners & Home Appliances including washing machines, refrigerators and other small domestic appliances.
Many critical RAC components, small domestic appliances, and some models of washing machines will be manufactured for Hisense using the existing infrastructure of EDL, helping EDL better utilize its current assets. EPACK will leverage its valuable experience and years of expertise through its state-of-the-art facilities and innovative manufacturing techniques, to streamline Hisense production, optimize asset utilization, while maintaining the highest standards of quality. This alliance will also see Hisense bringing in its technological expertise along with premium design capabilities.
EPACK Durable will immediately invest, firstly, in a new manufacturing facility in Sricity (Andhra Pradesh) with a capacity of 1.0 million RACs by Financial Year 27-28, with initial production set to begin in June 2025. Both companies are committed to sustainable practices and are excited about implementing eco-friendly manufacturing processes that align with their shared values.
Expanding Global Reach
The products manufactured at EPACK Durable’s facilities will not only serve the Indian market but Hisense will also explore opportunities to export these products to key international strategic markets. This initiative is set to strengthen the positions of both Hisense and EPACK in the global home appliances and air conditioners market. This strategic cooperation agreement with Hisense is likely to garner additional revenue of approximately $1 billion over the next 5 years for EPACK Durable and its subsidiary.
Pankaj Rana, CEO of Hisense India, said, “Hisense is committed to delivering premium quality and smart products with state-of-the-art design to our customers. This partnership with EPACK Durable combines Hisense’s technological expertise with EPACK’s manufacturing capabilities. Through this alliance, we aim to achieve a leadership position in the Indian consumer durables market and expand our presence in strategic global markets.”
Mr. Laxmi Pat Bothra, Director of EPACK Durable Limited, said, “Our agreement with Hisense is a significant milestone. By leveraging advanced technologies and innovative designs, we aim to deliver exceptional value to our customers and set new benchmarks in quality and efficiency within the home appliance sector.
